Our Thermal Interface Material solutions are designed to provide efficient heat transfer between heat-generating components and cooling surfaces. Thermal Paste fills microscopic surface irregularities, creating an effective thermal interface while helping minimize thermal resistance, whereas Thermal Gap Fillers are designed to fill larger gaps and surface irregularities between components and heat-dissipating surfaces.
These solutions are developed for applications where efficient thermal management, reliable heat dissipation, and consistent long-term performance are required. Compatherm® Thermal Paste offers high thermal conductivity, excellent long-term stability, and a non-curing formulation suitable for demanding electronics and industrial applications. Liquid-dispensed Thermal Gap Fillers provide excellent conformability and can adapt to complex or irregular component geometries while helping minimize mechanical stress on sensitive components.
High-performance thermal paste designed to create exceptionally thin thermal interfaces, helping reduce thermal resistance and improve heat dissipation in high-power electronic applications.
The paste can be applied through dispensing as well as screen-printing processes, supporting consistent thermal interface application across different manufacturing requirements.
Highly conformable thermal materials designed to accommodate uneven surfaces and component tolerances while maintaining effective thermal contact with minimal mechanical stress.
Thermally conductive gap fillers developed for applications requiring efficient heat transfer, low thermal resistance, electrical insulation, and stable performance under demanding operating conditions.
Compatherm® Thermal Paste belongs to the thin-bond-line category of Thermal Interface Materials. Its formulation is engineered to establish a highly efficient thermal path between a heat source and heat sink, supporting effective cooling and reliable operation of electronic components.
The product range includes silicone-based formulations with thermally conductive ceramic fillers. Available grades provide different levels of thermal conductivity, thermal resistance, viscosity, density, dielectric breakdown voltage, and bond line thickness to address varying thermal management requirements.
Selected Compatherm® paste grades provide thermal conductivity from 2.5 to 5.0 W/(m-K), with bond line thickness capabilities down to approximately 20 microns depending on the formulation.
Thermal Gap Fillers are particularly useful where components and heat sinks have uneven surfaces or varying geometries. By filling microscopic and larger air gaps, the material helps establish effective thermal contact and improves the transfer of heat away from sensitive electronic components.
Their flexible dispensing characteristics make them suitable for complex assemblies where conventional thermal interface materials may be difficult to apply. The material can conform to arbitrary geometries while helping compensate for component and assembly tolerances.
Thermal gap filler solutions can also be integrated with automated dispensing equipment, supporting precise and repeatable application for large-scale manufacturing. This makes them suitable for applications where consistent thermal performance and production efficiency are important.
Thermal Paste and Thermal Gap Fillers are suitable for a wide range of electronic and industrial applications where efficient heat dissipation and reliable thermal contact are required. They can be used in automotive electronics, telecom and networking equipment, power electronics, industrial electronics, communication equipment, and other high-tech applications.
Thermal Paste is particularly suitable for applications requiring very thin thermal interfaces and close thermal contact between components and cooling solutions. Thermal Gap Fillers are useful where larger gaps, uneven surfaces, complex geometries, or varying component tolerances need to be accommodated.
Depending on the application, materials can be selected according to thermal conductivity, thermal resistance, viscosity, dispensing requirements, bond-line thickness, operating temperature, electrical insulation, and other performance requirements.
The Compatherm® Paste range includes multiple material grades developed for different thermal performance requirements. The available formulations include silicone matrices with ceramic or ceramic-aluminium thermally conductive fillers, allowing selection according to conductivity, thermal resistance, viscosity, density, and bond line requirements.
With grades such as 9532, 9543, and 9550, the material range offers thermal conductivity values of 2.5, 4.3, and 5.0 W/(m-K), respectively, with thermal resistance values measured at 40 psi ranging from 0.30 to 0.05 °C·cm²/W.
These thermal interface materials are designed to provide efficient heat dissipation while maintaining stable performance and compatibility with manufacturing processes such as dispensing and screen printing.
We provide Thermal Paste and Thermal Gap Filler solutions that can be adapted to specific thermal management requirements. Different material characteristics, thermal performance levels, dispensing properties, and application conditions can be considered to achieve the required balance between thermal performance, manufacturability, and component protection.
Whether you need a high-performance thermal paste for an ultra-thin bond line, a highly conformable thermal filler for complex geometries, or a thermally conductive material for demanding production environments, our solutions are designed to support efficient heat management, reliable thermal contact, and consistent long-term performance.
By combining the thin-bond-line performance of Thermal Paste with the conformability and gap-filling capability of Thermal Gap Fillers, these Thermal Interface Material solutions provide versatile options for modern thermal management requirements. Their combination of thermal performance, processability, adaptability, and long-term stability makes them suitable for demanding electronics and industrial cooling applications.
Sarthhak Resolve Global Private Limited is an authorized distributor of globally recognized brands, delivering high-quality industrial solutions for automotive and EMS industries with reliability and technical expertise.
© 2026 Copyright reserved by Sarthhak Resolve Global
Private Limited
Designed & Developed by
